P.O.P PROCESS
https://www.kpmtech.co.kr/enK CHEM CL[M,A,B]
Concept of Electroless Deposition of Nikel Plating : K-Chem CL
- ※ Assures superior adhesion and stability.
- ※ Suppresses burning of points of contact with the rack.
- ※ Improved economic feasibility due to optimized automation.
- ※ Optimal liquid amount change based on concentration of the
- replenishing solution.
Initial Reaction Test
KPM POP Process
Stable Deposit rate vs EDS vs SEM .
